Servizi di assemblaggio di circuiti stampati BGA PCB Produttore in Cina

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Servizi di assemblaggio di circuiti stampati BGA PCB Produttore in Cina

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May 17, 2024

Category Connection: Assemblea del PWB

Chiacchierare Contattici

Tag:

#Prototipo PCBway #assemblea del PWB del volume basso #Servizio dell'Assemblea del PWB

Brief: Discover the advanced BGA PCB Printed Circuit Board Assembly Services Process in China. Our high-density, high-performance BGA PCBs feature immersion gold finish, precise testing, and superior thermal conductivity for optimal electronic performance.

Related Product Features:

Material: Fr4 1.6mm with 6 layers for durability and reliability.
Surface finish: Immersion gold for enhanced conductivity and corrosion resistance.
Peso di rame: 70UM, garantendo elevate prestazioni elettriche.
Assembly components: IC chips with 484 footprint for high-density integration.
Testing: X-Ray inspection for quality assurance.
Min line width and space: 3mil for precision and compact design.
Solder mask and silkscreen included for protection and labeling.
La tecnologia di packaging BGA offre proprietà termiche ed elettriche superiori.

Interrogazioni:

What is BGA packaging technology?

BGA (Ball Grid Array) is a high-density surface mount packaging technology with spherical pins arranged in a lattice pattern, offering better thermal and electrical performance compared to traditional packages.
Quali sono i vantaggi dei PCB BGA?

I PCB BGA forniscono elevata densità, conduzione termica superiore e condotti a bassa induttanza, che li rendono ideali per circuiti elettronici ad alta velocità e disegni compatti.
How is the BGA PCB assembly process conducted?

The process includes component procurement, PCB fabrication, precise component placement using pick-and-place machines, soldering (reflow or wave), inspection, testing, and final assembly to ensure quality and functionality.